High-Tech / Electronics companies have been widely using simulation tools for drop testing, packaging, and lifecycle prediction. Manufacturers will benefit from our full range of simulation capabilities.


VIAS provides integrated, innovative, and cost-effective engineering and software solutions to simulate the behavior of advanced material models for electronics applications, modern progressive fracture/failure capabilities, best-in-class solver performance, and interactive capabilities in order to make model generation and preparation more efficient. Our team is capable of performing analysis of thermal, electrical, mechanical (both static and dynamic) and moisture-sensitivity load regimes.


Solutions and Applications

  • Acoustics
  • Circuit Boards
  • Computers & Peripherals
  • Hand-held Devices
  • Microelectro-mechanical Systems
  • Paper Feeding
  • Semiconductor

Realistic Simulation & Validation Analysis

  • Thermal flow/cooling
  • Drop test
  • Heat transfer
  • Noise/Acoustic
  • Thermo-mechanical
  • Vibration
  • Electromagnetic compliance
  • Structural analysis
  • Electrostatic analysis